Laser Cutting Silicon Wafer

It works as a two stage process in which defect regions are firstly introduced into the wafer by scanning the beam along intended cutting lines and secondly an underlying carrier membrane is expanded to induce fracture.

Laser cutting silicon wafer. Laser cutting of silicon wafers is possible in all sizes and thicknesses with feature sizes as small as 20 microns. Dicing of silicon wafers may also be performed by a laser based technique the so called stealth dicing process. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. Solutions are available for machining smaller diameter wafers from larger ones solar cell downsizing or silicon stencil cutting.

However laser ablation has its own problems. Material thickness up to 1mm. Demonstration of cutting features into 1 5 mm thick silicon wafers using a laser micromachining system equipped with a qcw laser. The figure shows 700 µm wafer downsizing top view and side view.

Laserod s systems division builds and integrates a full line of diode and fiber laser micromachining equipment for uses that include silicon wafer resizing resistor trimming cutting thin metals and plastics scribing substrates of alumina and silicon resistor trimming and patterning thin films such as ito on glass or plastic. All that is required is a drawing to getting started. Due to the reflection it only made slight scratch and could not cut. Sapphire silicon wafer cutter.

Cut features are round holes with no cracking or rough edges. For silicon wafers less than 100 μm thick laser ablation offers an alternative to the blade technique which is too powerful for the delicate thin wafers. Blackstar is a wafer dicing system utilizing fantom width laser dicing technology fwldt invented and patented by laser photonics and modified to accommodate the requirements of a silicon wafer singulation process without affecting the existent dicing method processes or procedures. Traditionally silicon wafers have been cut with diamond saws occasionally using a scribe and break process which have the limitation that they can only cut straight lines and suffer from edge chipping and frequency doubled vanadate lasers which are both slow and expensive to operate as is the microjet process.